Tribology In Chemical-Mechanical Planarization - 9780824725679
Un libro in lingua di Hong Liang Craven David R. edito da Taylor & Francis, 2005
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Rates of chemical-mechanical planarization (CMP) are dependent largely on tribology in the process of wear on nanosurfaces. To address the needs of researchers needing more information in either or both CMP and tribology, the authors first present the basic processes associated, then show through text and illustrations information about surface properties and friction, lubrication (including boundary lubrication), wear in CMP (including pad wear) and force transmission. They also describe the configuration of CMP pads and the importance of Post-CMP cleaning. They provide references for each chapter. Annotation ©2004 Book News, Inc., Portland, OR (booknews.com)
Informazioni bibliografiche
- Titolo del Libro in lingua: Tribology In Chemical-Mechanical Planarization
- Autori : Hong Liang Craven David R.
- Editore: Taylor & Francis
- Collana: Taylor & Francis (Hardcover)
- Data di Pubblicazione: 28 Gennaio '05
- Genere: SCIENCE
- Argomenti : Tribology Grinding and polishing Chemical mechanical planarization
- Pagine: 185
- Peso gr: 407
- Dimensioni mm: 234 x 158 x 12
- ISBN-10: 0824725670
- EAN-13: 9780824725679