Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System - 9784431547945
Un libro in lingua di Seiji Samukawa edito da Springer Verlag, 2014
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This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.
Informazioni bibliografiche
- Titolo del Libro in lingua: Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
- Lingua: English
- Autore: Seiji Samukawa
- Editore: Springer Verlag
- Collana: Springer Verlag (Paperback)
- Data di Pubblicazione: 17 Febbraio '14
- Genere: TECHNOLOGY and ENGINEERING
- Pagine: 40
- Dimensioni mm: 234 x 154 x 0
- EAN-13: 9784431547945